Bystronic Breaks Ground on New Headquarters

March 15, 2011

Bystronic officials—John Kemp, applications manager; Bernard Arteaga, product manager; Bob St. Aubin, president; Johan Elster, market division leader for NAFTA and northern Europe; and Jim Johnson, vice president, sales—escape the single-digit temperatures and break ground indoors on the company’s new North American headquarters building.

How do you break ground on a new building when it’s the middle of a U.S. Midwest winter and the ground doesn’t break so easily? You move it indoors.

That’s what Bystronic Inc. did in January as the machine toolmaker marked the finalization of a deal to build its new North American headquarters in Elgin, Ill., moving it from Hauppauge, N.Y. Working inside the comfortable confines of a nearby warehouse, Bystronic representatives placed shovels into dirt that was moved from the lot on which the headquarters will be built.

“This is a very large step for us and a very important step for us in North America and in the metal fabricating industry,” said Bystronic President Bob. St. Aubin.

The new building will have a 14,000-sq.-ft. showroom for metal fabricating equipment and 10,000 sq. ft. of offices. Bystronic officials expect to occupy the office in early summer and fully occupy the facility by October. For more information, visit www.bystronicusa.com.